Tel：+086 13662663653 
Skype: wendy_lee886
Wechat: wx13662663653
WhatsApp: +86 136 6266 3653
Email:support@PCBBay.com
USD
EUR
GBP
CAD
CNY
SAR
SGD
NZD
ARS
INR
COP
AED
PCB process Capabilities
| PCB layout design Capabilities |
Rigid PCB Capabilities |
Flexible PCB Capabilities |
Rigid-Flex PCB Capabilitie | HDI PCB Capabilities | PCB'A (SMT) Capabilities |
1. Process Capabilities of PCB layout design
| Max layer | 42 | Min Trace width | 2.4mil |
| Max PIN number | 110000+ | Max number of connections | 78000+ |
| Min Space of BGA PINS | 0.3mm | Max number of BGA-PIN | 2912 |
| Max signal frequency | 60GHZ | Min Trace Space | 2.4mil |
| Total number of pins on PCB | Delivery days (business days) |
| 1000以内 | 3-5 |
| 2000-3000 | 5-7 |
| 4000-5000 | 8-12 |
| 6000-7000 | 12-15 |
| 8000-9000 | 15-18 |
| 10000-13000 | 18-20 |
| 14000-15000 | 20-22 |
| 16000-20000 | 22-30 |
2.Process Capabilities of Rigid PCB
| classifi cation |
item | Rigid PCB process capability | Detail |
| Base board | Layer | 1-48 | |
| Board Material | CEM-1、CEM-3、FR4 (High Tg, Halogen Free),High Frequency, Heavy Copper,Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial,PtFe,BT. |
||
| Materials brand | KB,Shengyi,Nanya,Isola, Goword,grace,Rogers,Arlon, Taconic,Ventec |
customer specify | |
| Max board size | 650x1060mm | Tolerance of the dimension size: +/-0.13mm | |
| board thickness | 0.13-6.0mm | Normal thickness：0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.5 mm | |
| board thickness Tolerance | ±5% | T>=1.0mm, Tol: +/-5% T<1.0mm, Tol:+/-0.1mm | |
| Hole | Min Hole Diameter (by machine) | 0.15mm | Recommended design is 0.3mm or more, if possible |
| Min Hole Diameter (by laser) | 0.05mm | ||
| drilling hole size tolerance (by laser) | ±0.01mm | tolerance by laser: ±0.01mm | |
| drilling hole size tolerance (by machine) | ±0.07mm | tolerance by machine: ±0.07mm | |
| Thickness to diameter ratio | 10:1 | ||
Hole diameter of half hole |
0.5mm | Half hole process is a special process, and the minimum hole diameter shall not be less than 0.5mm | |
| Max hole diameter of NPTH | 6.50mm | ||
| Max hole diameter of PTH | 6.50mm | (filished hole diameter of PTH) Tol: +/-0.05mm | |
| welding ring of through hole single side | 4mil | Via with a minimum of 4mil and device hole with a minimum of 6mil, increasing the through-hole welding ring is helpful for over-current | |
| line | Min Trace width | 3mils（1oz Finish Cu） | 4/4mil(copper thickness 1 OZ)，5/5mil(copper thickness 2 OZ)，8/8mil(copper thickness 3 OZ)，It is recommended to increase the line width and line spacing if conditions permit |
| Min Trace space | 3mils（1oz finish Cu) | 4/4mil(copper thickness 1 OZ)，5/5mil(copper thickness 2 OZ)，8/8mil(copper thickness 3 OZ)，It is recommended to increase the line width and line spacing if conditions permit | |
| Line to board edge distance | ≥0.3mm（12mil） | CNC:≥0.3mm V-cut:≥0.4mm | |
| Copper weight | Copper weight for Internal layer | 1/3-14OZ | Refers to the connecting line width of two copper sheets in the line |
| Copper weight for External layer | 1/3-12OZ | Refers to the thickness of the copper foil of the outer circuit of the finished circuit board | |
| Special process | Special production process | Resin plug hole, pan hole, Rogers mixed pressing plate, blind hole, bonding IC (special process needs to be reviewed first), blue glue, red tape | |
| character | Aspect ratio of character | 1:5 | Suitable ratio of width and height, more conducive to production |
| Character height | ≥0.8mm | The minimum height of characters. If it is less than 0.8mm, the characters of the physical board may not be clear due to design reasons | |
| Character width | ≥0.1mm | The minimum width of characters. If it is less than 0.6mm, the physical board may cause unclear characters due to design reasons | |
| Surface Coating | Surface Coating | Immersion Gold,HAL,HAL Pb free,OSP,ENIG, Immersion Tin,Immersion silver,plating Gold, Carbon oil,Hard Gold, Gold Finger |
Immersion Gold Au: 2-6U" HASL Sn:100-1000U" Immersion silver Ag: 0.15um-0.75um OSP Thicknes: 0.20-0.50um Gold Finger Au:30-60U",bevel edge 20°,30°, 45° Hard Gold Au:30-60U" Immersion Tin Sn:0.8-1.2um |
| Solder Mask color | Gloss & matte green | Red, Black, Yellow, Blue,white | |
| Immersion gold | Au: 2-6U'' | ||
| HASL with lead | Sn:100-1000U'' | ||
| HASL lead free | Sn:100-1000U'' | ||
| Immersion silver | Ag: 0.15um-0.75um | ||
| OSP | Thicknes: 0.20-0.50um | ||
| gold finger | Au:30-60U'' | ||
| hard gold | Au:30-60U'' | ||
| Carbon oil | Carbon oil | sun serial | |
| Immersion Tin | Sn:0.8-1.2um | ||
| Beveling for gold finger / v-cut | Bevel angle | 20,30, 45 Degree | |
| solder mask Bridge | 0.1mm |
3.Process Capabilities of Flexible PCB
| classification | Specification | unit | Standard |
| Min inner layer pad size | mil | 7<=6 layer) 10( >7layer) | |
| Min grid line witth/space(negative fim) | mil | 5/5(1/2 0z basel,6.5/5(1oz base),8/5.5(2 oz base) | |
| Min via pad ring width(one side) | mil | 5 (via pattern plating if less 5mil) | |
| Slot hole size tolerance | mm | +/-0.15 | |
| Min space from outer layer conductor to Rigid-flex conjunct point |
mil | 8 | |
| Min deep control slot width at Rigid-flx conjunct point | mm | 5 | |
| Flex material | FCCL supplier | TAIFLEX | |
| FCCL PI thickness | mil | 0.5, 1 | |
| FCCL copper thickness | oz | 0.5, 1 | |
| CVL thickness | mil | 0.5,1,2 | |
| PI stiffener thickness | mil | 3, 5 | |
| adhesive thickness | um | 25,40 | |
| lower flow prepreg | Arlon 1080(49N) | ||
| adhesive requirement on stack-up | adhesive thickness>=total adjacent copper thickness; only adhesive between two conductor layer is not allowed. |
||
| CVL requirement on stack-up | CVL thickness >75% of total adjacent copper thickness |
4.Process Capabilities of Rigid-Flex PCB
| classification | Specfication | unit | Standard |
| Inspection standard | Quality Inspection | IPC 6013 Class I,IPC-A-600G | |
| Test method | IPC-TM- 650,GB/T4677-2002 | ||
| General Capability (Rigid-flex) | Max layer | layer | 1-6(flex), 2-10(Rigid-flex) Special:12-16(Rigid-flex) |
| Board thickness(minimal -maximal | mm | 0.07 - 4.0 | |
| Maximal board size | inch | 10*18 | |
| Contour tolerance by CNC machine | mm | +/-0.15 | |
| Contour tolerance by laser | mm | +/-0.05 | |
| Manual cutting outline | mm | +/-0.5mm | |
| Min layer registration | mil | 8 | |
| Stffener location deviation tolerance | mm | +/-0.2 | |
| Min SMT pads space for immersion gold or goldplating |
mil | 5 | |
| Min thickness of single layer | mm | 0.07 | |
| Min thickness of double layer | mm | 0.16 | |
| Board thickness tolerance (<=0.3mm) |
mm | +/-0.075 | |
| Board thickness tolerance (0.3mm-1.0mm) |
mm | +/-0.1 | |
| Board thickness(>1.0mm) | % | +/- 10 | |
| Min finished copper thickness in inner layer(1/2 0z base) |
um | 12 | |
| Min finished copper thickness in inner layer(1oz base) |
um | 25 | |
| Aspect Ratio | 10:1(min hole size 0.20mm) | ||
| Min space from hole wall to conductor |
mil | 8(2 layer), 10(3,4 layer), 12(>=5 layer) | |
| Min space form hole wall to conductor(Buried/Blind hole) |
mil | 9( 1 laminating process), 10( over 2 laminating process) |
5.Process Capabilities of HDI PCB
| No. | Item | HDI PCB Process Capability |
| 1 | Layer | 4-12 Layer |
| 2 | Stage | 1+N+1/ 2+N+2/ 3+N+3 |
| 3 | Min. Trace Width/Space | 2.5/2.5mil |
| 4 | Min. Mechanical Drilling | 0.15mm |
| 5 | Min. Laser Drilling | 0.1mm |
| 6 | PTH Plating Aspect Ratio | 12:01 |
| 7 | Electroless Plating Aspect Ratio | 0.8:1 |
| 8 | 4L Min. Finished Board Thickness | 0.4mm |
| 9 | 6L Min. Finished Board Thickness | 0.6mm |
| 10 | 8L Min. Finished Board Thickness | 1.0mm |
| 11 | Min. BGA Center Distance | 0.5mm |
| 12 | Min. Solder Resist Opening | 0.05mm |
6. Process Capabilities of PCB'A (SMT)
| capacity of SMT production: | 3.5 million solder joints / day |
| SMT production line: | 6 set |
| Throwing rate: | Resistance and capacitance: 0.3% |
| IC: no throwing | |
| Board type: | POP/Rigid PCB/FPC/Rigid-flex PCB/Metal Core PCB |
| Specification of mounting components | Min Component Package | 03015 Chip/0.35 Pitch BGA |
| Component Size accuracy | ±0.04mm | |
| IC chip precision | ±0.03mm | |
| Specification of mounting PCB | PCB size | 50*50mm -774*710mm |
| PCB thickness | 0.3-6.5mm |
